High Density Intrerconnection

Time: 2014-03-14
HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch , wiring density above 117 inches / square inch and line width / spacing below 3mil/3mil. HDI is mainly used in mobile phones, cameras, camcorders, laptops, network card, IC carrier board, military, medical and other different areas.
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