What's PCB Depth Control Routing Technology?

What's PCB Depth Control Routing Technology?


There are three main method of manufacture stepstair PCB: Depth control routing, filling cushion material, embedding cushion material. Analysis principle and characteristic of every method, submit the main request in the process flows, introduce some special structure stepstair PCB.

What's PCB Depth Control Routing Technology?
What is the stepstair PCB?
The Stepstair PCB, the popular definition: In the circuit board production process, the local area by lamination, paneling, etc. to form a high degree of uneven area (groove or step). Stepstair circuit boards have a special shape in the board and therefore have unique advantages in the altimetry and assembly of the board, as follows:

Using the edge of the stepstair card slot is conducive to the circuit board fixed and installation.

Make use of the stepped groove made in the local area of the board to weld the special components or modules to realize the specific functions, meanwhile, reduce the overall height of the assembled devices to realize the assembly refinement and miniaturization.

Using NPTH step slot groove to prevent welding due to siphon effect caused by the pad on the tin caused by serious short circuit and other poor welding.

Use a specific size of the NPTH step slot as the microwave signal emitted by the resonant cavity, reducing signal loss.

There are two main methods of manufacture stepstair PCB :

Depth controlled routing PCB
The main inspection stepstair groove depth control requirements and production capacity.

Filling and embeding the gasket plate

The main check glue flow control methods, the edge of the stepstair groove patterns and the reliability of the hole and the size of the production capacity ladder.
PCBQuick Production capacity:

The Machine-controlled deep-processing of the production of high-precision step board requirements of the equipment, PCBQuick can reach +/- 4mil precision, the production process is as follows:

Fixed by the plate to keep the board surface and table formation

With the first knife point as the benchmark, follow-up no longer adjust the depth compensation

Measure and compensate for the blind-cut depth each time

Panel milling process dynamically compensate for blind milling depth

2layer, FR4 1.6mm, Copper thickness: 35um, Green Soldermask and White silkscreen, Finished Surface: ENIG, Min Line width/space:4/4mil, The PCB Depth Control routing 1.0mm, Routing edge and made in the local area of the board.
2layers, FR4 2.8mm, Copper thickness: 35um, Green Soldermask and White silkscreen, Finishing Surface: ENIG, Min Line width/space: 4/4mil, The PCB Depth Control Routing 1.2mm.
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