Rigid PCB
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As we know, the rigid PCB prototype classification has the following main points:
FR-4 (glass fiber cloth base), CEM-1/3 (glass fiber and paper composite substrate), FR-1 (paper-based copper clad composite board), metal-based copper clad board (mainly aluminum, a small amount of iron base More types of materials than are currently common, often referred to as rigid PCBs. Among them, FR4 is the most common material. The FR4 material is usually TG 130. More than 130, we call it a special pcb material.
Rigid PCB product manufacturing capability
| No | project | Process capability |
| 1 | Surface treatment | HASL, gold immersion, gold plating, OSP, immersion tin, etc. |
| 2 | Floor | 1-30 floors |
| 3 | Minimum line width | 3mil |
| 4 | Min.Line Space | 3mil |
| 5 | Minimum spacing between Pad.Pad | 3mil |
| 6 | Min.Hole diameter | 0.10 mm |
| 7 | Min.Bonding Pad Diameter | 10MIL |
| 8 | Maximum drilling ratio and thickness | 1:12:05 |
| 9 | Complete the board's Max.Size | 23inch * 35inch |
| 10 | Plate thickness | 0.21-7.0mm |
| 11 | Minimum thickness solder mask | 10um |
| 12 | Solder mask | Green, yellow, black, white, red, transparent photosensitive solder mask, peelable solder mask |
| 13 | Minimum Idents line width | 4MIL |
| 14 | The smallest IdentsHeight | 25mil |
| 15 | Screen color | White, yellow, black |
| 16 | Date file format | Gerber files and drilling files, report series, PADS 2000 series, powerpcb series, ODB ++ |
| 17 | E-test | 100% electronic test: high voltage test |
| 18 | PCB material | High TG material: high frequency (ROGERS, TEFLON, TADONIC, ARLON): no Haloger material |
| 19 | Other tests | Impedance test, resistance test, microdissection, etc. |
| 20 | Special technical requirements | Blind and buried holes and high thickness copper |
Rigid PCB
Printed Circuit Board Manufacturer - PCBQuick
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Material: FR4
Plate thickness: 1.6mmCopper thickness: 35um
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: no HAL
Material: FR4
Plate thickness: 1.6mm
Copper thickness: 35um
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: no HAL
Material: FR4
Plate thickness: 1.6mm
Copper thickness: 1 ounce
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: HASL
Gold finger
Material: FR4
Plate thickness: 1.6mm
Copper thickness: 35um
Minimum hole: 0.2mm
Solder Mask: Green
Screen color: white
Surface technology: no HAL
CNC
Material :FR4
Board Thickness :1.6mmCopper Thickness: 35um
Min Holes : 0.8mm
Solder mask :White
Silkscreen Color : Black
Surface Technics :HAL-Free
Material :FR4
Board Thickness :1.6mmCopper Thickness: 35um
Min Holes : 0.2mm
Solder mask :Red
Silkscreen Color :White
Surface Technics : ENIG
Material :FR4
Board Thickness :1.6mmCopper Thickness: 35um
Min Holes : 0.2mm
Solder mask :Blue
Silkscreen Color :White
Surface Technics :HAL-Free
Material :FR4
Board Thickness :1.6mmCopper Thickness: 35um
Min Holes : 0.2mm
Solder mask :Black
Silkscreen Color :White
Surface Technics :HAL-Free
Material: Copper
Thickness: 1.6mm
Solder mask: white
Screen printing: black
Type: single layer
Technology: ENIG
Material: FR4
Thickness: 0.53 +/- 0.1mm
Solder Mask: Green
Screen printing: white
Type: 6-layer pcb
Technology: 6-layer blind via PCB, minimum hole: 0.2mm, minimum line width and space: 3mil / 3mil. BGA 0.5mm,
Material: FR4
Thickness: 1.6mm
Solder Mask: Green
Screen printing: white
Type: 4 layer pcb
Technology: ENIG
Material: FR4
Thickness: 1.6mm
Solder mask: black
Screen printing: white
Type: 4 layer pcb
Technology: ENIG
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