flexible printed circuits supplier with 10 years factory experience
- Model
- KF-FPC
Item specifics
- Base Material
- pi
- Copper Thickness
- 1oz
- Board Thickness
- 0.1-0.22mm
- Min. Hole Diameter
- 0.2mm
- Min. Line Width
- 0.1mm
- Min. Line Spacing
- 0.1mm
- Surface Finishing
- enig
- solder mask
- yellow
- silk screen
- white
- certificates
- rohs,iso,ul
Review
Description
flexible printed circuits supplier with 10 years factory experience
Flexible Capability | ||
| No | Item | Technical data |
| 1 | Flexible layers | 1~8layer |
| 2 | Minimum Trace and Space | 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm |
| 3 | Minimum Space Betw en Coverlay Openings | 0.2mm |
| 4 | Edge of Coverlay Opening to Trace | 0.20mm(preferred) |
| 5 | Minimum Space between coverlay and solder pad | 0.15mm |
| 6 | Polyimide Films | 0.5 mil (12.5), 1 mil (25), 2 mils (50), 3 mils (75), 4mils(100), 5 mils(125) as custmer requested |
| 7 | Thermobond Adhesives | Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
| 8 | Copper Foils (RA or ED) | 1/3oz (12), 1/2oz (18), 1oz (35), 2oz (70) |
| 9 | Stiffeners | Polyimide, rigid FR4, PSA, metal, or customer supplied&requested |
| 10 | FR-4 in Multi-layer Flex Circuits | Laminated to flex circuit to create rigid flex boards, typically with vias. |
| 11 | Surface Finish | Electroless Ni/Au, Electrolytic soft/hard gold, Tin plating,,Imm.Tin,Entek/OSP |
| 12 | Solder Resists | Coverlay, Photo-Imagable Resist |
| 13 | Hole tolerance | ±0.05mm |
| 14 | Smallest Drill Size | 0.2mm |
| 15 | Largest Drill Size | 6.35mm |
| 16 | Smallest Slot Width | 0.35mm |
| 17 | Min.space between holes | 0.15mm |
| 18 | Minimum conductor edge to outline edge | ≥0.1mm |
| 19 | Minimum space between coverlay and conductor | ± 0.15mm |
| 20 | Hole to outline edge | ≥ 0.10mm |
| 21 | Tooling tolerances | Knife(Soft) tooling : ± 0.25mm |
| Steel(Hard) tooling : ± 0.05mm | ||
| CNC drill/rout : ± 0.10mm | ||
| 22 | Maximum Layer to Layer Mis-registration | ± 0.10mm |
| 23 | Copper Plated Thickness(PTH only) | 8~15um;20~30um;30~70um(special) |
| 24 | Au thickness | Electroless Ni/Au Ni:2~6um;Au:0.035~0.075um Electrolyticsoft/hardgoldNi:2~9um;Au:0.035~0.1um |
flexible printed circuit process flow
Flexible pcb board show:
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Flexible Printed Circuits Manufacturer Quality Requirement:
KingFung now implementing international quality system includes: UL ,TS 16949 ,ISO 14001, ISO 9001
Shenzhen King Fung Technology Co., Ltd is a high-tech enterprise exporting samples and bulk production of printed circuit boards. We have nearly 10,000 square meter production plants, specializing in the production of HDI phone boards, communication boards, as well as a variety of single-sided, double-sided, multi-layer, high-frequency TG circuit boards and aluminum base boards with high technical content and strict quality requirements.
