high density interconnect pcb 6Layer Blind Buried Via HDI PCB
high density interconnect pcb 6Layer Blind Buried Via HDI PCB
high density interconnect pcb 6Layer Blind Buried Via HDI PCB
high density interconnect pcb 6Layer Blind Buried Via HDI PCB
high density interconnect pcb 6Layer Blind Buried Via HDI PCB
Model
KF-HDI PCB-03

Item specifics

Material
FR4
Board Thickness
0.53+/-0.1mm
Copper Thickness
Inner layer 17um,External layer
Soldermask Color
Green
Silkscreen Color
White
Surface Technics
ENIG

Product review

Description

high density interconnect pcb 6Layer Blind Buried Via HDI PCB

Product Description


Board Thickness: 0.53+/-0.1mm

Soldermask Color: Green

Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)

Min Line width and space:3mil/3mil

<p vertical-align:baseline;line-height:1.2;color:#555555;white-space:normal;background-color:#ffffff;"="" style="word-wrap: break-word; margin: 0px; font-family: "sans serif", tahoma, verdana, helvetica; box-sizing: border-box; padding: 0px; border-width: 0px; border-style: initial; border-color: initial; font-size: 14px;">BGA 0.5mm

Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6


HDI PCB Manufacturing Process


HDI PCB Stack Up