high density interconnect pcb 6Layer Blind Buried Via HDI PCB
- Model
- KF-HDI PCB-03
Item specifics
- Material
- FR4
- Board Thickness
- 0.53+/-0.1mm
- Copper Thickness
- Inner layer 17um,External layer
- Soldermask Color
- Green
- Silkscreen Color
- White
- Surface Technics
- ENIG
Review
Description
high density interconnect pcb 6Layer Blind Buried Via HDI PCB
Product Description
Board Thickness: 0.53+/-0.1mm
Soldermask Color: Green
Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)
Min Line width and space:3mil/3mil
<p vertical-align:baseline;line-height:1.2;color:#555555;white-space:normal;background-color:#ffffff;"="" style="word-wrap: break-word; margin: 0px; font-family: "sans serif", tahoma, verdana, helvetica; box-sizing: border-box; padding: 0px; border-width: 0px; border-style: initial; border-color: initial; font-size: 14px;">BGA 0.5mmDrill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6
HDI PCB Manufacturing Process
HDI PCB Stack Up
