Design for fast 94v-0 led pcb prototype board motherboard
- Model
- KF-FR4 PCB-08
Item specifics
- Base Material:
- FR4
- Copper Thickness
- 1oz
- Board Thickness
- 1.6mm
- Min. Hole Size
- 0.2mm
- Min. Line Width
- 0.2mm
- solder mask
- white
- silk screen
- black
Review
Description
Specifications
NO | Item | Craft Ability |
1 | Surface Finish | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc |
2 | Layer | 1-30 layers |
3 | Min.Line Width | 3mil |
4 | Min.Line Space | 3mil |
5 | Min.Space between Pad to Pad | 3mil |
6 | Min.Hole Diameter | 0.10mm |
7 | Min.Bonding Pad Diameter | 10mil |
8 | Max.Proportion of Drilling Hole and Board Thickness | 1:12:05 |
9 | Max.Size of Finish Board | 23inch*35inch |
10 | Rang of Finish Board′s Thickness | 0.21-7.0mm |
11 | Min.Thickness of Soldermask | 10um |
12 | Soldermask | Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask |
13 | Min.Linewidth of Idents | 4mil |
14 | Min.Height of Idents | 25mil |
15 | Color of Silk-screen | White,Yellow,Black |
16 | Date File Format | Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++ |
17 | E-testing | 100%E-Test:High Voltage Testing |
18 | Material for PCB | High TG Material:High Frequence(ROGERS,TEFLON,TADONIC,ARLON):Haloger free Material |
19 | Other Test | Impedance Testing,Resisitance Testing,Microsection etc |
20 | Special Technological Requirement | Blind&Buried Vias and High Thickness Copper |
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