PHYSICAL ADVANTAGES FOR FLEX
- ●More flexibility, as the name suggests.
- ●Improved resistance to vibrations and movement; lower mass/weight.
- ●Small package size.
- ●Allows the board to bend to its desired applicable shape.
- ●Allows for more compact devices.
- ●High tensile strength—can be significantly warped/deformed without breakage.
- ●High bendiness—up to 360 degrees.
- ●Easier to prepare for harsh environments.
- ●The use of flexible flat cables (FCC), which can bend without being damaged, and takes up less space than traditional wires
MANUFACTURING & ASSEMBLY ADVANTAGES
●Increase in design freedom.
- ●Installation flexibility.
- ●Increased reliability and durability.
- ●Improved heat dissipation.
- ●Improved airflow.
|Quality Grade||Standard IPC 2||Material||DuPont PI, Domestic Shengyi PI|
|Number of Layers||1 - 8layers||Board Size||Min 6*6mm, Max 406*610mm|
|Order Quantity||1pc - 10000+pcs||Board Thickness||0.1mm - 0.8mm|
|Build Time||2days - 5weeks||Copper Weight (Finished)||0.5oz - 2.0oz|
|Min Tracing/Spacing||3mil/3mil||Silkscreen Sides||As per the file|
|Solder Mask Sides||As per the file||Silkscreen Color||White, Black, Yellow|
|Solder Mask Color||Green, White, Blue, Black, Red, Yellow||Surface Finish||HASL - Hot air solder leveling|
|Solder-stop coating---Soldermask oil||Green, White, Blue, Black, Red, Yellow||Lead - free HASL - RoHS|
|Solder-stop coating---Coverlay||PI and PET film||ENIG - RoHS|
|Min Annular Ring||4mil||Immersion Tin - RoHS|
|Min Drilling Hole Diameter||8mil||OSP - RoHS|
|Min. hole size---Drilling (PTH)||0.2mil||Other Techniques||Peelable solder mask|
|Min. hole size---Punching (NPTH)||0.5mil||Gold fingers|
|Tolerance of dimension||±0.05mm||Stiffener (only for PI/FR4 substrate)|
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