Flex Circuit Board Assembly Services︱flexible circuitry
Flex Circuit Board Assembly Services︱flexible circuitry
Flex Circuit Board Assembly Services︱flexible circuitry
Flex Circuit Board Assembly Services︱flexible circuitry
Flex Circuit Board Assembly Services︱flexible circuitry
Flex Circuit Board Assembly Services︱flexible circuitry
Model
KF-flexible pcb-07

Item specifics

Material
Dupont PI
Baord Thickness
0.1mm-0.8mm
Layer
1-8Layers
Silkscreen Color
White, Black, Yellow
Copper Thickness
0.5OZ-2.0OZ

Review

Description

PHYSICAL ADVANTAGES FOR FLEX
  • ●More flexibility, as the name suggests.
  • ●Improved resistance to vibrations and movement; lower mass/weight.
  • ●Small package size.
  • ●Allows the board to bend to its desired applicable shape.
  • ●Allows for more compact devices.
  • ●High tensile strength—can be significantly warped/deformed without breakage.
  • ●High bendiness—up to 360 degrees.
  • ●Easier to prepare for harsh environments.
  • ●The use of flexible flat cables (FCC), which can bend without being damaged, and takes up less space than traditional wires
MANUFACTURING & ASSEMBLY ADVANTAGES
Increase in design freedom.
  • ●Installation flexibility.
  • ●Increased reliability and durability.
  • ●Improved heat dissipation.
  • ●Improved airflow.
Quality GradeStandard IPC 2MaterialDuPont PI, Domestic Shengyi PI
Number of Layers1 - 8layersBoard SizeMin 6*6mm, Max 406*610mm
Order Quantity1pc - 10000+pcsBoard Thickness0.1mm - 0.8mm
Build Time2days - 5weeksCopper Weight (Finished)0.5oz - 2.0oz
Min Tracing/Spacing3mil/3milSilkscreen SidesAs per the file
Solder Mask SidesAs per the fileSilkscreen ColorWhite, Black, Yellow
Solder Mask ColorGreen, White, Blue, Black, Red, YellowSurface FinishHASL - Hot air solder leveling 
Solder-stop coating---Soldermask oilGreen, White, Blue, Black, Red, YellowLead - free HASL - RoHS 
Solder-stop coating---CoverlayPI and PET filmENIG - RoHS 
Min Annular Ring4milImmersion Tin - RoHS 
Min Drilling Hole Diameter8milOSP - RoHS
Min. hole size---Drilling (PTH)0.2milOther TechniquesPeelable solder mask 
Min. hole size---Punching (NPTH)0.5milGold fingers 
Tolerance of dimension±0.05mmStiffener (only for PI/FR4 substrate)
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