Flex Circuit Board Assembly Services︱flexible circuitry

Item specifics

PHYSICAL ADVANTAGES FOR FLEX

●More flexibility, as the name suggests.
●Improved resistance to vibrations and movement; lower mass/weight.
●Small package size.
●Allows the board to bend to its desired applicable shape.
●Allows for more compact devices.
●High tensile strength—can be significantly warped/deformed without breakage.
●High bendiness—up to 360 degrees.
●Easier to prepare for harsh environments.
●The use of flexible flat cables (FCC), which can bend without being damaged, and takes up less space than traditional wires

MANUFACTURING & ASSEMBLY ADVANTAGES

●Increase in design freedom.

Quality Grade	Standard IPC 2	Material	DuPont PI, Domestic Shengyi PI
Number of Layers	1 - 8layers	Board Size	Min 66mm, Max 406610mm
Order Quantity	1pc - 10000+pcs	Board Thickness	0.1mm - 0.8mm
Build Time	2days - 5weeks	Copper Weight (Finished)	0.5oz - 2.0oz
Min Tracing/Spacing	3mil/3mil	Silkscreen Sides	As per the file
Solder Mask Sides	As per the file	Silkscreen Color	White, Black, Yellow
Solder Mask Color	Green, White, Blue, Black, Red, Yellow	Surface Finish	HASL - Hot air solder leveling
Solder-stop coating---Soldermask oil	Green, White, Blue, Black, Red, Yellow		Lead - free HASL - RoHS
Solder-stop coating---Coverlay	PI and PET film		ENIG - RoHS
Min Annular Ring	4mil		Immersion Tin - RoHS
Min Drilling Hole Diameter	8mil		OSP - RoHS
Min. hole size---Drilling (PTH)	0.2mil	Other Techniques	Peelable solder mask
Min. hole size---Punching (NPTH)	0.5mil		Gold fingers
Tolerance of dimension	±0.05mm		Stiffener (only for PI/FR4 substrate)