FR4 Multilayer PCB Manufacturing With Blue Peelable Mask Layer

FR4 Multilayer PCB Manufacturing With Blue Peelable Mask Layer

Model: KF-FR4 PCB-52

Item specifics

Material: FR4

Board Thickness: 1.6mm

Soldermask Color: Green

Silkscreen Color: White

Surface Technics: ENIG

Review

Description

Blue peelable mask layer is applied to:

1. Corrosion protection of various acid and alkali solutions;

2. Protection against electric corrosion of various electroplating solutions;

3. Various electroless plating protection.

Do not print blue glue under the following circumstances

1, surface treatment for tin, silver and other easy to be oxidized and easy to wipe the board, not printed blue glue.

Reason: this plate surface treatment process is easy to be oxidized, can not bake the plate, but after printing the blue glue must be through the baking plate to solidify the blue glue.

2, not double-sided printing blue glue.Reason:

A) double-sided blue glue enters the hole, and it is difficult to tear off the blue glue;

B) after printing one side, the blue glue bulges, causing uneven, inconvenient printing the other side, and easy to cause plate bending problems;

C) plate bending is not easy to measure.

Peelable mask pcb performance

1. No solvent volatilization, environmental protection and safety, almost 100% solid content, almost the same thickness of dry and wet film;

2. High thixotropy, effectively ensuring smooth screen printing edge, strong cover pore force and slight vertical flow;

3, good adhesion is not peeling off;

4. Easy to peel, complete, no residual flow, no impact on the bottom layer;

5, does not contain any metal and non-metal monomer, corrosion resistance process will not dissolve any material, no impact on the original solution. The pass hole is easy to be peeled off without residue and has no effect on the original solution.

Curing conditions

Required drying conditions	First printing	Second printing	Double-sided printing
Cabinet oven temperature & time	150℃ 5min	150℃ 3-10min	150℃ 15-20min
Infrared tunnel furnace temperature & time	160℃/180℃ 1-1.5min	160℃/180℃ 2-3min	160℃/180℃ 2-3min
Uv curing Energy, speed	1000-3000J 4-5min	1000-3000J 3-4min	1000-3000J 3-4min

Fr4 multilayer PCB process capability

NO	Item	Craft Ability
1	Surface Finish	HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2	Layer	1-30 layers
3	Min.Line Width	3mil
4	Min.Line Space	3mil
5	Min.Space between Pad to Pad	3mil
6	Min.Hole Diameter	0.10mm
7	Min.Bonding Pad Diameter	10mil
8	Max.Proportion of Drilling Hole and Board Thickness	1:12:05
9	Max.Size of Finish Board	23inch*35inch
10	Rang of Finish Board′s Thickness	0.21-7.0mm
11	Min.Thickness of Soldermask	10um
12	Soldermask	Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask
13	Min.Linewidth of Idents	4mil
14	Min.Height of Idents	25mil
15	Color of Silk-screen	White,Yellow,Black
16	Date File Format	Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++
17	E-testing	100%E-Test:High Voltage Testing
18	Material for PCB	High TG Material:High Frequence(ROGERS,TEFLON,TADONIC,ARLON):Haloger free Material
19	Other Test	Impedance Testing,Resisitance Testing,Microsection etc
20	Special Technological Requirement	Blind&Buried Vias and High Thickness Copper