As the general FR-4 materials have thermal expansion problems, especially in the thickness direction of the plate thermal expansion, metallization holes, the quality of the affected line.
This is mainly due to the differences in the thermal expansion coefficients of the slab in the thickness direction of the raw material:
The thermal expansion coefficient of copper is 17 × 10 6 cm / cm • ° C,
FR-4 board substrate is 110 × 106cm / cm • ℃,
The difference between the two is easy to produce: the difference between the expansion of the heated substrate, so that the copper lines and metal-induced fracture damage, affecting product reliability.
The thermal expansion coefficient of the aluminum substrate is 50 × 10 6 cm / cm • ° C, which is smaller than that of a typical FR-4 plate and closer to the thermal expansion coefficient of the copper foil. This will help ensure the quality and reliability of printed circuit boards.
Applicable to different circuits, different applications, FR-4 board for general circuit design and general electronic products. Aluminum-based materials for the LED lighting industry and high-power thermal products.