PCBQuick has been focusing on the design and production of thick copper circuit boards for many years and has summarized its own production experience:
The main purpose of thickening copper plating is to ensure that the copper coating is thick enough in the hole and the resistance value is within the range of the technical requirements.
1. preparation and inspection of plating treatment before plating
(1). Mainly check the metallization quality of the hole, and make sure there are no residual objects, burrs, black holes, holes, etc.;
(2). Check whether there is any dirt and other surplus on the surface of the substrate;
(3). Check the number, drawing number, process documents and process description of the substrate;
(4). Clear the mounting parts, mounting requirements and coating area that the plating tank can withstand;
(5). The coating area and process parameters should be clearly defined to ensure the stability and feasibility of plating process parameters;
(6). The cleaning and preparation of the conductive parts and the first electrification treatment make the solution appear to be activated;
(7). Determine whether the tank liquid component is qualified and the surface area of the plate is in the state; If a spherical anode is used, the consumption must be checked.
(8). Check the firmness of the contact area and the range of voltage and current fluctuations.
2. Quality control of thickened copper plating
(1). The accurate calculation of plating area and the impact on the current reference for the practical production process, the right to determine the current required values, grasp the current changes in the electroplating process, to ensure the stability of plating process parameters;
(2). Before plating, the commissioning plate is firstly used for trial plating, so that the tank liquid is activated;
(3). Determine the direction of the total current flow, and then determine the order of the hanging plate. Ensure the uniformity of the current distribution to any surface;
(4). Ensure the uniformity of the plating layer in the hole and the consistency of the thickness of the plating layer. In addition to the technological measures of stirring filtration, shock current should be adopted.
(5). Constantly monitor the changes of current during plating to ensure the reliability and stability of current value;
(6). Check whether the thickness of the copper plating layer of the hole meets the technical requirements.