8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick

Group Multilayer PCB
Min. Order 1 piece
Terms of Payment L/C, D/A, D/P, Western Union, MoneyGram, T/T, Paypal
Update Time 2018-08-30
Item specifics
MaterialFR4
Board Thickness1.6mm
Soldermask ColorBlack
Silkscreen ColorWhite
Surface TechnicsENIG
Min Holes0.2mm
Min Line space and width5/5mil
Description
8 Layer Multilayer PCB Fabrication Printed Circuit Board

Product Description


Material: FR4 Multilayer PCB Fabrication
Board Thickness: 1.6mm
Soldermask Color: Black
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line space and width: 5/5mil


FR4 Made Ability


 NO ItemCraft Ability1Surface Finishh

HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2Layer2-30 layers3Min. Line Width3 mil4Min. Line Space3 mil5Min. Space between Pad to Pad3 mil6Min.Hole Diameter0.10 mm7Min. Bonding Pad Diameter10 mil8Max. Proportion of Drilling Hole and Board Thickness1:12:59Max. Size of Finish Board23 inch*35 inch10Rang of Finish Board's Thickness0.21-7.0 mm11Min. Thickness of Soldermask10 um12SoldermaskGreen,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask13Min. Linewidth of Idents4 mil14Min. Height of Idents25 mil15Color of Silk-screenWhite,Yellow,Black16Date File FormatGerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++17E-testing100% E-Testing:High Voltage Testing18Material for PCBHigh TG Material:High Frequence

(ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material 

19Other TestImpedance Testing,Resistance Testing,Microsection etc20Special Technological RequirementBlind&Buried Vias and High Thickness Copper


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