FR4 1.6mm Depth Control Routing Circuit Bard

Group Double Sided PCB
Min. Order 3 piece
Terms of Payment L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
Update Time 2018-11-30
Item specifics
Base materialFR4
Layer2L
Board thickness1.6mm
Soldermaskgreen
Surface finishENIG
Silkscreenwhite
cooper1oz
Description
Layers: 2 Layer
PCB Material: FR4 TG130
Board Thickness: 1.6mm
Surface Finishing: ENIG(Gold thickness 2u”)
Finished Copper thickness: 1/1 OZ
Solder mask: Green 

Slikscreen: White
Special Process:

Minimum track width/space: 4/4 mil

PCB Depth Control Routing 1.0mm, Depth Control Routing edge and made in the local area of the board.

Standard PCB Capability:
Minimum Circuit Trace Width/Space: 3/3mil
The Minimum Via Size: 0.2mm
The Minimum Legend Height/Width: 0.5mm/0.15mm
Surface Finishing: HASL-LF, ENIG, ENEPIG, OSP, Gold Finger, Hard Gold Plating, Immersion Silver, Immersion Tin
Special Technology: Blind&Buried Via, Via In Pad, Backdrill, Small BGA PAD, Impedance control, Heavy Copper, Copper Filled Vias, Countersink hole, Depth Milling
Material Type: FR4, Metal Core, Halogen Free, FR4 High TG, Rogers, PTFE, Arlon, Nelco, Polyimide
Final Board Thickness: 0.2mm - 6.0mm
Final Copper Thickness: HOZ, 1OZ, 2OZ, 3OZ, 4OZ, 5OZ, 6OZ, 10OZ
FR4 Substrate Thickness: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.36mm, 2.8mm
Shaping: CNC Routing, Punching, V-CUT, Depth milling, Castellation
Special Hole: Blind&Buried hole, Depth milling, T-slot, Countersink holes, Step holes, 
Quick Turn Delivery time: 12hours for 1layer PCB, 24Hours for 2layer PCB, 48Hours for 4layer PCB, 72hours for 6layer PCB