8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick
8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick
8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick
8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick
8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick
8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick
Model
KF-FR4 PCB-06

Item specifics

Material
FR4
Board Thickness
1.6mm
Soldermask Color
Black
Silkscreen Color
White
Surface Technics
ENIG
Min Holes
0.2mm
Min Line space and width
5/5mil

Product review

Description

8 Layer Multilayer PCB Fabrication Printed Circuit Board


Product Description

Material: FR4 Multilayer PCB Fabrication
Board Thickness: 1.6mm
Soldermask Color: Black
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line space and width: 5/5mil

FR4 Made Ability


 NO ItemCraft Ability
1

Surface Finishh

HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2Layer2-30 layers
3Min. Line Width3 mil
4Min. Line Space3 mil
5Min. Space between Pad to Pad3 mil
6Min.Hole Diameter0.10 mm
7Min. Bonding Pad Diameter10 mil
8Max. Proportion of Drilling Hole and Board Thickness1:12:5
9Max. Size of Finish Board23 inch*35 inch
10Rang of Finish Board's Thickness0.21-7.0 mm
11Min. Thickness of Soldermask10 um
12SoldermaskGreen,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask
13Min. Linewidth of Idents4 mil
14Min. Height of Idents25 mil
15Color of Silk-screenWhite,Yellow,Black
16Date File FormatGerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++
17E-testing100% E-Testing:High Voltage Testing
18Material for PCB

High TG Material:High Frequence

(ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material 

19Other TestImpedance Testing,Resistance Testing,Microsection etc
20Special Technological RequirementBlind&Buried Vias and High Thickness Copper

Certificate

Image