8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick
- Model
- KF-FR4 PCB-06
Item specifics
- Material
- FR4
- Board Thickness
- 1.6mm
- Soldermask Color
- Black
- Silkscreen Color
- White
- Surface Technics
- ENIG
- Min Holes
- 0.2mm
- Min Line space and width
- 5/5mil
Review
Description
8 Layer Multilayer PCB Fabrication Printed Circuit Board
Product Description
Material: FR4 Multilayer PCB Fabrication
Board Thickness: 1.6mm
Soldermask Color: Black
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line space and width: 5/5mil
FR4 Made Ability
| NO | Item | Craft Ability |
|---|---|---|
| 1 | Surface Finishh | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc |
| 2 | Layer | 2-30 layers |
| 3 | Min. Line Width | 3 mil |
| 4 | Min. Line Space | 3 mil |
| 5 | Min. Space between Pad to Pad | 3 mil |
| 6 | Min.Hole Diameter | 0.10 mm |
| 7 | Min. Bonding Pad Diameter | 10 mil |
| 8 | Max. Proportion of Drilling Hole and Board Thickness | 1:12:5 |
| 9 | Max. Size of Finish Board | 23 inch*35 inch |
| 10 | Rang of Finish Board's Thickness | 0.21-7.0 mm |
| 11 | Min. Thickness of Soldermask | 10 um |
| 12 | Soldermask | Green,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask |
| 13 | Min. Linewidth of Idents | 4 mil |
| 14 | Min. Height of Idents | 25 mil |
| 15 | Color of Silk-screen | White,Yellow,Black |
| 16 | Date File Format | Gerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++ |
| 17 | E-testing | 100% E-Testing:High Voltage Testing |
| 18 | Material for PCB | High TG Material:High Frequence (ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material |
| 19 | Other Test | Impedance Testing,Resistance Testing,Microsection etc |
| 20 | Special Technological Requirement | Blind&Buried Vias and High Thickness Copper |
Certificate
