8 Layer Multilayer PCB Fabrication Printed Circuit Board-pcbquick

Group Multilayer PCB
Min. Order 1 piece
Terms of Payment L/C, D/A, D/P, Western Union, MoneyGram, T/T, Paypal
Update Time 2018-08-30
Item specifics
MaterialFR4
Board Thickness1.6mm
Soldermask ColorBlack
Silkscreen ColorWhite
Surface TechnicsENIG
Min Holes0.2mm
Min Line space and width5/5mil
  • Description
  • Product review

8 Layer Multilayer PCB Fabrication Printed Circuit Board


Product Description


Material: FR4 Multilayer PCB Fabrication
Board Thickness: 1.6mm
Soldermask Color: Black
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line space and width: 5/5mil


FR4 Made Ability


 NO ItemCraft Ability
1

Surface Finishh

HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2Layer2-30 layers
3Min. Line Width3 mil
4Min. Line Space3 mil
5Min. Space between Pad to Pad3 mil
6Min.Hole Diameter0.10 mm
7Min. Bonding Pad Diameter10 mil
8Max. Proportion of Drilling Hole and Board Thickness1:12:5
9Max. Size of Finish Board23 inch*35 inch
10Rang of Finish Board's Thickness0.21-7.0 mm
11Min. Thickness of Soldermask10 um
12SoldermaskGreen,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask
13Min. Linewidth of Idents4 mil
14Min. Height of Idents25 mil
15Color of Silk-screenWhite,Yellow,Black
16Date File FormatGerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++
17E-testing100% E-Testing:High Voltage Testing
18Material for PCB

High TG Material:High Frequence

(ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material 

19Other TestImpedance Testing,Resistance Testing,Microsection etc
20Special Technological RequirementBlind&Buried Vias and High Thickness Copper



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